100 mm x 0,5 mm GPU CPU dzesētāja dzesēšanas siltumvadošs silikona paliktnis

Specifications: Heat conductive silicone thermal compound pads. Thermal pads can avoid the uneven application between the heatsinks and IC chips. Improve the effectiveness of your heatsink and reduce the operating temperature of your processor, video card, decreasing the chance of premature failure. This product is suitable for GPU/CPU/VGA/BGA bridge chips. Item Name: Thermal Pad Material: Silicone Continuous Temperature: -40℃ - 260℃ Thermal Conductivity: 3.2w/m-K Breakdown Voltage: 4kv/mm Size: 100mm x 100mm x 0.5mm/3.94" x 3.94" x 0.02" (Approx.) Notes: Due to the light and screen setting difference, the item's color may be slightly different from the pictures. Please allow slight dimension difference due to different manual measurement. Package Included: 1 x Thermal Pad